1209.2 Location of Notice
The following specific methods of affixation and positions of the notice are acceptable:
• A gummed or other label securely affixed or imprinted upon the package or other container used as a permanent receptacle for the semiconductor chip product; or
• A notice imprinted or otherwise affixed in or on the top or other visible layer of the product.
37 C.F.R. § 211.6.